Next Level Epitaxy

Lower deposition temperatures, lower energy and process gas consumption, faster production and combination of new materials for wide-bandgap semiconductors. ELEMENT 3—5 leaps epitaxy to the next level.

FLEXIBLE AND SUCCESSFUL
Maximum efficiency
Novel design combined with our innovative in-line manufacturing concept is the basis for scalable mass-production and significant increase in efficiency.

NEW APPROACH,NEW POSSIBILITIES
Vertically integrated production
ELEMENT 3—5 sets new standards in the manufacturing process mode of semiconductors. For this purpose, we set up the wafer vertically and thus achieve the greatest possible homogeneity and particle-free production.

LOWER DEPOSITION TEMPERATURE, LOWER COST
Highest quality
Our unique process method enables deposition of monocrystalline structures of the highest quality at temperatures below 300 °C. Thus, the production is much more environmentally friendly, energy-saving and also more cost-efficient than the conventional process techniques.

LOWER TEMPERATURE,MORE CHOICES
Leveraging new potentials
We are opening up completely new opportunities for the semiconductor industry. Due to process temperatures below 300 °C, temperature-sensitive substrates can be deployed, materials beyond the 3rd and 5th main groups can be deposited and new stacks can be built in.