Chips lead worldwide innovation
Without chips we can't live in smart houses, drive our autonomous cars or communicate through a 5G network. CITC implements chip technology in answering the societal challenges of the 21th century.

Four programlines have been defined by CITC team

1. Thermal high-performance packaging (Rugged interconnects for Power Semiconductors & Molding compound with improved thermal conductivity)
2. RF chip packaging (Antenna-in-Package: Evolutionary track & Revolutionary track)
3. Digital package manufacturing (Printing of RDL circuit, Die integration, Supporting activities)
4. Integrated photonic chip packaging (Piece-wise assembly & Wafer Level packaging)

With a yearly cycle of development within these programlines, based on the company inputs, CITC will demonstrate prototype chip packages and work on ensuring relevance and direct deployable results. If you want more details on one of these topics, please contact us.